ATA663201/03/31/54

DS20006075D-page 30

 2018-2021 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

Y2

X2

2.50

1.70

MILLIMETERS

0.65 BSC

MIN

E

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

Y1

X1

0.80

0.35

Microchip Technology Drawing C04-23358 Rev C

NOM

8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN]

12

8

C

Contact Pad Spacing

3.00

Contact Pad to Center Pad (X8)

G1

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks

C

E

X1

Y1

Y2

EV

ØV

G1

SILK SCREEN

EV

X2

Pin 1 Index Chamfer

CH

0.20

Contact Pad to Contact Pad (X6)

G2

0.20

G2

CH