F1978 Datasheet

© 2017 Integrated Device Technology, Inc.

8

Rev O August 28, 2017

Thermal Characteristics

Table 6.

Package Thermal Characteristics

Parameter

Symbol

Value

Units

Junction to Ambient Thermal Resistance

θJA

50

°C/W

Junction to Case Thermal Resistance

(Case is defined as the exposed paddle)

θJC-BOT

3

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

Typical Operating Conditions (TOC)

Unless otherwise noted for the TOC graphs on the following pages, the following conditions apply.



VDD = +3.3V



ZL = ZS = 75Ω single-ended



TEP = +25°C



fRF = 1GHz



PIN = 0dBm for single tone measurements



PIN = +10dBm/tone for multi-tone measurements



Tone spacing = 50MHz



Evaluation Board connector and board losses are de-embedded



Measured in a 75Ω system unless otherwise specified