DLPA2000 datasheet(12/68 Pages) TI

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V(VDD)

Core power 1.1 V (main 1.1 V)

1.045

1.10

1.155

V(VDDLP12)

Reserved(4)

1.045

1.10

1.155

V(VCC18)

All 1.8-V I/O power:

(1.8-V power supply for all I/O pins except the host

or parallel interface and the SPI flash interface. This

includes RESETZ, PARKZ LED_SEL, CMP_OUT, GPIO,

IIC1, TSTPT, and JTAG pins.)

1.64

1.80

1.96

V(VCC_INTF)

Host or parallel interface I/O power: 1.8 V (includes IIC0,

PDATA, video syncs, and HOST_IRQ pins)

See (1)

1.64

1.80

1.96

2.28

2.50

2.72

3.02

3.30

3.58

V(VCC_FLSH)

Flash interface I/O power: 1.8 V to 3.3 V

See (1)

1.64

1.80

1.96

2.28

2.50

2.72

3.02

3.30

3.58

V(VDD_PLLM)

MCG PLL 1.1-V power

See (2)

1.025

1.100

1.155

V(VDD_PLLD)

DCG PLL 1.1-V power

See (2)

1.025

1.100

1.155

Operating ambient temperature(3)

–30

°C

Operating junction temperature

–30

105

°C

(1)

These supplies have multiple valid ranges.

(2)

The minimum voltage is lower than other 1.1-V supply minimum to enable additional filtering. This filtering may result in an IR drop

across the filter.

(3)

The operating ambient temperature range assumes 0 forced air flow, a JEDEC JESD51 junction-to-ambient thermal resistance value

at 0 forced air flow (RθJA at 0 m/s), a JEDEC JESD51 standard test card and environment, along with minimum and maximum

estimated power dissipation across process, voltage, and temperature. Thermal conditions vary by application, and this affects RθJA.

Thus, maximum operating ambient temperature varies by application.

•

Ta_min = Tj_min – (Pd_min × RθJA) = –30°C – (0.0 W × 30.3°C/W) = –30°C

•

Ta_max = Tj_max – (Pd_max × RθJA) = +105°C – (0.348 W × 30.3°C/W) = +94.4°C

(4)

VDDLP12 must be tied to the VDD rail.

6.4 Thermal Information

THERMAL METRIC(1)

DLPC34x6

UNIT

ZVB (NFBGA)

176 PINS

RθJC

Junction-to-case top thermal resistance

11.2

°C/W

RθJA

Junction-to-air thermal resistance

at 0 m/s of forced airflow(2)

30.3

°C/W

at 1 m/s of forced airflow(2)

27.4

at 2 m/s of forced airflow(2)

26.6

ψJT

Temperature variance from junction to package top center temperature, per unit power

dissipation(3)

0.27

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics Application Report.

(2)

Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined

standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC34x6 PCB and thus the reported thermal

resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best

information available during the design phase to estimate thermal performance.

(3)

Example: (0.5 W) × (0.2°C/W) ≈ 0.1°C temperature rise.

DLPC3436

DLPS156E – JANUARY 2019 – REVISED APRIL 2023

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