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LM5069 Datasheet(PDF) 15 Page - National Semiconductor (TI) |
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LM5069 Datasheet(HTML) 15 Page - National Semiconductor (TI) |
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15 / 22 page ![]() Application Information (Refer to Figure 1) (Continued) Limit section. For example, if R S is 10 m Ω , and the desired power limit threshold is 60W, R PWR calculates to 75 k Ω.If Q1’s power dissipation reaches the threshold Q1’s gate is modulated to reduce the load current, keeping Q1’s power from exceeding the threshold. For proper operation of the power limiting feature, R PWR must be ≤150 kΩ. While the power limiting circuit is active, the fault timer is active as described in the Fault Timer & Restart section. Typically, power limit is reached during startup, or if the output voltage falls due to a severe overload or short circuit. The programmed maximum power dissipation should have a reasonable margin from the maximum power defined by the FET’s SOA chart if the LM5069-2 is used since the FET will be repeatedly stressed during fault restart cycles. The FET manufacturer should be consulted for guidelines. If the application does not require use of the power limit function the PWR pin can be left open. TURN-ON TIME The output turn-on time depends on whether the LM5069 operates in current limit, or in both power limit and current limit, during turn-on. A) Turn-on with current limit only: The current limit thresh- old (I LIM) is determined by the current sense resistor (RS). If the current limit threshold is less than the current defined by the power limit threshold at maximum V DS the circuit oper- ates at the current limit threshold only during turn-on. Refer- ring to Figure 11a, as the load current reaches I LIM, the gate-to-source voltage is controlled at V GSL to maintain the current at I LIM. As the output voltage reaches its final value (V DS ) 0V) the drain current reduces to its normal operating value, and the gate is charged to approximately 12V (V GATE). The time for the OUT pin voltage to transition from zero volts to V SYS is equal to: where C L is the load capacitance. For example, if VSYS = 48V, C L = 1000 µF, and ILIM = 1A, tON calculates to 48 ms. The maximum instantaneous power dissipated in the MOS- FET is 48W. This calculation assumes the time from t1 to t2 in Figure 11a is small compared to t ON, and the load does not draw any current until after the output voltage has reached its final value, and PGD switches high (Figure 9). If the load draws current during the turn-on sequence (Figure 10), the turn-on time is longer than the above calculation, and is approximately equal to: where R L is the load resistance. The Fault Timeout Period must be set longer than t ON to prevent a fault shutdown before the turn-on sequence is complete. B) Turn-on with power limit and current limit: The maxi- mum allowed power dissipation in Q1 (P FET(LIM)) is defined by the resistor at the PWR pin, and the current sense resistor R S. See the Power Limit Threshold section. If the current limit threshold (I LIM) is higher than the current defined by the power limit threshold at maximum V DS (PFET(LIM)/VSYS) the circuit operates initially at the power limit mode when the V DS of Q1 is high, and then transitions to current limit mode as the current increases to I LIM and VDS decreases. See Figure 11b. Assuming the load (R L) is not connected during turn-on, the time for the output voltage to reach its final value is approximately equal to: For example, if V SYS = 48V, CL = 1000 µF, ILIM = 1A, and P FET(LIM) = 20W, tON calculates to )68 ms, and the initial current level (I P) is approximately 0.42A. The Fault Timeout Period must be set longer than t ON. 20197222 FIGURE 9. No Load Current During Turn-On 20197223 FIGURE 10. Load Draws Current During Turn-On www.national.com 15 |
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