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TMP1827 Datasheet(PDF) 63 Page - Texas Instruments |
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TMP1827 Datasheet(HTML) 63 Page - Texas Instruments |
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63 / 65 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND (0.88) 6X (0.5) (2.3) 8X (0.25) 8X (0.6) (1.85) (R0.05) TYP WSON - 0.8 mm max height NGR0008C PLASTIC SMALL OUTLINE - NO LEAD 4227008/D 03/2022 SYMM 1 4 5 8 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:30X 9 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL |
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