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VL53L8CH Datasheet(PDF) 32 Page - STMicroelectronics |
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VL53L8CH Datasheet(HTML) 32 Page - STMicroelectronics |
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32 / 44 page ![]() Note: A thermal pad is required on the application board for thermal dissipation purpose. For more information, refer to AN5897. Note: For more information, refer to the pin description in Section 2.5 Device pinout. Figure 30. Outline drawing (2/3) - module with liner VL53L8CH Outline drawings DS14310 - Rev 3 page 32/44 |
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