Document Number: MC33661

Rev. 6.0, 11/2006

Freescale Semiconductor

Advance Information

* This document contains certain information on a new product.

Specifications and information herein are subject to change without notice.

© Freescale Semiconductor, Inc., 2006. All rights reserved.

Local Area Network (LIN)

Enhanced Physical Interface

with Selectable Slew Rate

Local Interconnect Network (LIN) is a serial communication protocol

designed to support automotive networks in conjunction with Controller

Area Network (CAN). As the lowest level of a hierarchical network, LIN

enables cost-effective communication with sensors and actuators

when all the features of CAN are not required.

The 33661 is a Physical Layer component dedicated to automotive

LIN sub-bus applications. It offers slew rate selection for optimized

operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for

test and programming modes, excellent radiated emission

performance, and safe behavior in the event of LIN bus short-to-ground

or LIN bus leakage during low-power mode.

The 33661 is compatible with LIN Protocol Specification 2.0.

Features

and Handles 40 V During Load Dump

• Active Bus Waveshaping Offering Excellent Radiated Emission

Performance

•5.0 kV ESD on LIN Bus Pin

•30 k

Ω Internal Pullup Resistor

• LIN Bus Short-to-Ground or High Leakage in Sleep Mode

•-18 V to +40 V DC Voltage at LIN Pin

•8.0

µA in Sleep Mode

• Local and Remote Wake-Up Capability Reported by INH and

RXD Pins

•5.0 V and 3.3 V Compatible Digital Inputs Without Any External

Components Required

• Pb-Free Packaging Designated by Suffix Code EF

Figure 1. 33661 Simplified Application Diagram

LIN PHYSICAL INTERFACE

33661

ORDERING INFORMATION

Device

Temperature

Package

MC33661D/R2

-40°C to 125°C

8 SOICN

MCZ33661EF/R2

D SUFFIX

EF SUFFIX (PB-FREE)

98ASB42564B

8-PIN SOICN

RXD

33661

MCU

TXD

EN

WAKE

LIN

INH

GND

VSUP

LIN Bus

5.0

V

Regulator

12 V