MPM54313 datasheet(6/49 Pages) MPS

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MPM54313

– 16V, TRIPLE 3A POWER MODULE WITH I2C

MPM54313 Rev. 1.0

MonolithicPower.com

5/7/2024

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ..................................... 18V

VSWA / VSWB / VSWC (DC) ........ -0.3V to VIN + 0.3V

VBSTA / VBSTB / VBSTC.............................. VSW + 4V

VOA / VOB / VOC .......................................... 6V

VCC .............................................................. 4.5V

VCC, ADDR1, ADDR2, PG (1s) (2)……..…....…6V

All other pins ................................-0.3V to +4.3V

Continuous power dissipation (TA = 25°C) (6)

………………………………………………7.67W

Junction temperature (TJ) .........................150°C

Storage temperature ................ -65°C to +170°C

ESD Ratings

Human body model (HBM) ........................ ±2kV

Charged-device model (CDM) .................. ±2kV

Recommended Operating Conditions (3)

Input voltage (VIN) ...............................4V to 16V

Output voltage (VOUT)......................0.4V to 5.5V

Operating junction temp (TJ). ... -40°C to +125°C

Thermal Resistance (4) (5) (6) (7) (8)

BGA (8mmx9mmx2.58mm)

θJA........................................................16.3°C/W

θJC_TOP....................................................0.2°C/W

θJB........................................................1.27°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Voltage rating during MTP programming.

The device is not guaranteed to function outside of its

operating conditions.

is junction-to-ambient thermal resistance,

JC_TOP

junction-to-case top thermal characterization parameter, and

JB is junction-to-board thermal characterization parameter.

5) The thermal parameter is based on test on an MPS evaluation

board (EVM54313-BJ-00A) under no airflow cooling conditions

in a standard enclosure. The board size is 8.1cmx8.1cm, 4-

layer, top/bottom copper thickness is 2oz, mid-layer 1/2 copper

thickness is 1oz.

6) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient thermal resistance,

JA, and the ambient temperature,

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can produce an excessive die temperature.

7) The junction-to-case top thermal characterization parameter,

JC_TOP, estimates the junction temperature in the real system,

based on equation TJ = θJC_TOP x PLOSS + TCASE_TOP, where PLOSS

is the

module’s entire power loss in a real application, and

TCASE_TOP is the case top temperature.

8) The junction-to-board thermal characterization parameter

, θ

JB,

is an estimation of the junction temperature in the real system,

based on equation TJ = θJB x PLOSS + TBOARD, where PLOSS is the

module’s entire power loss in a real application, and T

BOARD is

the board temperature.

MPM54313 Datasheet(PDF) 6 Page - Monolithic Power Systems

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