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H838024 Datasheet(PDF) 60 Page - Renesas Technology Corp |
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H838024 Datasheet(HTML) 60 Page - Renesas Technology Corp |
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60 / 697 page ![]() Section 1 Overview Rev. 7.00 Mar 10, 2005 page 18 of 652 REJ09B0042-0700 Table 1.4 Bonding Pad Coordinates of HCD64338024S, HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S Coordinates Coordinates Pad No. Pad Name X ( µµµµm) Y ( µµµµm) Pad No. Pad Name X ( µµµµm) Y ( µµµµm) 1AVCC –1338 1053 41 P84/SEG29 1338 –1121 2 P13/TMIG –1338 823 42 P85/SEG30 1338 –929 3 P14/ IRQ4/ADTRG –1338 737 43 P86/SEG31 1338 –820 4 P16 –1338 649 44 P87/SEG32 1338 –721 5 P17/ IRQ3/TMIF –1338 556 45 PA3/COM4 1338 –610 6 X1 –1338 460 46 PA2/COM3 1338 –499 7 X2 –1338 363 47 PA1/COM2 1338 –388 8VSS = AVSS –1338 229 48 PA0/COM1 1338 –277 9 OSC2 –1338 100 49 V3 1338 –189 10 OSC1 –1338 13 50 V2 1338 –91 11 TEST –1338 –74 51 V1 1338 6 12 RES –1338 –168 52 VCC 1338 156 13 P50/ WKP0/SEG1 –1338 –265 53 VSS 1338 362 14 P51/ WKP1/SEG2 –1338 –373 54 P90/PWM1 1338 528 15 P52/ WKP2/SEG3 –1338 –481 55 P91/PWM2 1338 614 16 P53/ WKP3/SEG4 –1338 –590 56 P92 1338 699 17 P54/ WKP4/SEG5 –1338 –698 57 P93 1338 785 18 P55/ WKP5/SEG6 –1338 –806 58 P94 1338 871 19 P56/ WKP6/SEG7 –1338 –892 59 P95 1338 957 20 P57/ WKP7/SEG8 –1338 –1091 60 IRQAEC 1338 1147 21 P60/SEG9 –1121 –1338 61 P30/UD 1131 1338 22 P61/SEG10 –927 –1338 62 P31/TMOFL 936 1338 23 P62/SEG11 –805 –1338 63 P32/TMOFH 831 1338 24 P63/SEG12 –703 –1338 64 P33 735 1338 25 P64/SEG13 –593 –1338 65 P34 631 1338 26 P65/SEG14 –483 –1338 66 P35 526 1338 27 P66/SEG15 –372 –1338 67 P36/AEVH 421 1338 28 P67/SEG16 –263 –1338 68 P37/AEVL 317 1338 29 P70/SEG17 –166 –1338 69 P40/SCK32 212 1338 30 P71/SEG18 –47 –1338 70 P41/RXD32 108 1338 31 P72/SEG19 55 –1338 71 P42/TXD32 3 1338 32 P73/SEG20 166 –1338 72 P43/ IRQ0 –101 1338 33 P74/SEG21 277 –1338 73 PB0/AN0 –249 1338 34 P75/SEG22 388 –1338 74 PB1/AN1 –362 1338 35 P76/SEG23 499 –1338 75 PB2/AN2 –476 1338 36 P77/SEG24 610 –1338 76 PB3/AN3/ IRQ1/TMIC –589 1338 37 P80/SEG25 701 –1338 77 PB4/AN4 –702 1338 38 P81/SEG26 790 –1338 78 PB5/AN5 –791 1338 39 P82/SEG27 885 –1338 79 PB6/AN6 –880 1338 40 P83/SEG28 1076 –1338 80 PB7/AN7 –1081 1338 Note: Pad No. 11 (TEST) should be connected to VSS. If it is not connected, the LSI will not operate correctly. These values show the coordinates of the centers of pads. The accuracy is ±5 µm. The home-point position is the chip’s center and the center is located at halfway between the upper and lower pads and the left and right pads. |
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