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BQ24192 Datasheet(PDF) 5 Page - Texas Instruments

Part # BQ24192
Description  bq2419x I2C Controlled 4.5-A Single Cell USB/Adapter Charger with Narrow VDC Power Path Management and USB OTG
PDF  53 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

BQ24192 Datasheet(HTML) 5 Page - Texas Instruments

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bq24190, bq24192, bq24192I
www.ti.com
SLUSAW5B – JANUARY 2012 – REVISED DECEMBER 2014
Pin Functions (continued)
PIN
NUMBER
TYPE
DESCRIPTION
bq24192
bq24190
bq24192I
ILIM pin sets the maximum input current limit by regulating the ILIM voltage at 1 V. A resistor is connected from
I
ILIM pin to ground to set the maximum limit as IINMAX = (1V/RILIM) × 530. The actual input current limit is the
ILIM
ILIM
10
Analog
lower one set by ILIM and by I2C REG00[2:0]. The minimum input current programmed on ILIM pin is 500 mA.
Temperature qualification voltage input #1. Connect a negative temperature coefficient thermistor. Program
I
TS1
TS1
11
temperature window with a resistor divider from REGN to TS1 to GND. Charge suspends when either TS pin is
Analog
out of range. Recommend 103AT-2 thermistor.
Temperature qualification voltage input #2. Connect a negative temperature coefficient thermistor. Program
I
TS2
TS2
12
temperature window with a resistor divider from REGN to TS2 to GND. Charge suspends when either TS pin is
Analog
out of range. Recommend 103AT-2 thermistor.
Battery connection point to the positive terminal of the battery pack. The internal BATFET is connected
BAT
BAT
13,14
P
between BAT and SYS. Connect a 10 µF closely to the BAT pin.
System connection point. The internal BATFET is connected between BAT and SYS. When the battery falls
SYS
SYS
15,16
P
below the minimum system voltage, switch-mode converter keeps SYS above the minimum system voltage.
(Refer to Application Information Section for inductor and capacitor selection.)
Power ground connection for high-current power converter node. Internally, PGND is connected to the source
of the n-channel LSFET. On PCB layout, connect directly to ground connection of input and output capacitors
PGND
PGND
17,18
P
of the charger. A single point connection is recommended between power PGND and the analog GND near the
IC PGND pin.
O
Switching node connecting to output inductor. Internally SW is connected to the source of the n-channel
SW
SW
19,20
HSFET and the drain of the n-channel LSFET. Connect the 0.047-µF bootstrap capacitor from SW to BTST.
Analog
PWM high side driver positive supply. Internally, the BTST is connected to the anode of the boost-strap diode.
BTST
BTST
21
P
Connect the 0.047-µF bootstrap capacitor from SW to BTST.
PWM low side driver positive supply output. Internally, REGN is connected to the cathode of the boost-strap
REGN
REGN
22
P
diode. Connect a 4.7-µF (10-V rating) ceramic capacitor from REGN to analog GND. The capacitor should be
placed close to the IC. REGN also serves as bias rail of TS1 and TS2 pins.
Connected to the drain of the reverse blocking MOSFET and the drain of HSFET. Given the total input
O
PMID
PMID
23
capacitance, connect a 1-µF capacitor on VBUS to PGND, and the rest all on PMID to PGND. (Refer to
Analog
Application Information Section for details)
Thermal
Exposed pad beneath the IC for heat dissipation. Always solder thermal pad to the board, and have vias on the
–
–
P
Pad
thermal pad plane star-connecting to PGND and ground plane for high-current power converter.
8 Specifications
8.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VBUS
–2
22
V
PMID
–0.3
22
V
STAT, PG
–0.3
20
V
BTST
–0.3
26
V
Voltage range (with
SW
–2
20
V
respect to GND)
BAT, SYS (converter not switching)
–0.3
6
V
SDA, SCL, INT, OTG, ILIM, REGN, TS1, TS2, CE, PSEL, D+, D–
–0.3
7
V
BTST TO SW
–0.3
–7
V
PGND to GND
–0.3
–0.3
V
Output sink current
INT, STAT, PG
6
mA
Junction temperature
–40°C
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
Copyright © 2012–2014, Texas Instruments Incorporated
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