OPA830 datasheet(42/66 Pages) TI2

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11 Layout

11.1 Layout Guidelines

The OPA835DBV, OPA836DBV EVM (SLOU314) can be used as a reference when designing the circuit

board. TI recommends following the EVM layout of the external components near the amplifier, ground-plane

construction, and power routing. General guidelines are listed as follows:

1. Signal routing must be direct and as short as possible into and out of the operational amplifier.

2. The feedback path must be short and direct avoiding vias if possible especially with G = +1.

3. Ground or power planes must be removed from directly under the negative input and output pins of the

amplifier.

4. TI recommends placing a series output resistor as close to the output pin as possible. See Series Output

Resistor vs Capacitive Load (Figure 7-17) for recommended values for the expected capacitive load.

5. A 2.2-µF power-supply decoupling capacitor must be placed within two inches of the device and can be

shared with other operational amplifiers. For spit supply, a capacitor is required for both supplies.

6. A 0.1-µF power-supply decoupling capacitor must be placed as close to the power supply pins as possible,

preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.

7. The PD pin uses TTL logic levels. If the pin is not used, it must be tied to the positive supply to enable the

amplifier. If the pin is used, it must be actively driven. A bypass capacitor is not necessary, but is used for

robustness in noisy environments.

OPA836, OPA2836

SLOS712J – JANUARY 2011 – REVISED MARCH 2021

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OPA830 Datasheet(PDF) 42 Page - Texas Instruments