MPQ7920 datasheet(6/44 Pages) MPS

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MPQ7920

– 5V POWER MANAGEMENT IC WITH I2C AND MTP, AEC-Q100

MPQ7920 Rev. 1.0

www.MonolithicPower.com

7/13/2020

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

VVIN1, VIN2, VIN3, VIN4, VIN5, AVIN ...................................

…………….. -0.3V to +6.5V (6.8V for 300ms)

VSWx………………………… ................................

-0.6V (-5V for <10ns) to VIN + 0.3V (7V for <10ns)

VEN1 …………………………......... -0.3V to +3.5V

All other pins

………………........ -0.3V to +6.25V

Continuous power dissipation (TA = 25°C) (2) (6)

QFN-26 (3.5mmx4.5mm)..

…….………….6.25W

Junction temperature

….………….……….150°C

Lead t

emperature……..………………….. 260°C

Storage temperature.

………….-65°C to +150°C

ESD Rating (3)

All other pins (HBM) ..................................±4kV

All pins (CDM) ...........................................±2kV

Recommended Operating Conditions (4)

Step-down regulator (VIN)………..…2.7V to 5.5V

Step-down regulator (VOUT)………………….0.4V

to 3.5875V or VIN

LDO regulator (VOUTL)…..0.65V to 3.5875V or VIN

Operating junction temp (TJ) ..............................

………………………………... -40°C to +125°C (5)

Thermal Resistance

θJA

θJC

QFN-26 (3.5mmx4.5mm)

EVQ7920-R-00A (6)................. 20 ....... 5.... °C/W

JESD51-7 (7)..............................44...... 9.... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation may cause excessive die temperature, and the

regulator can go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) HBM, per JEDEC specification JESD22-A114; CDM, per

JEDEC

specification

JESD22-C101,

AEC

specification

AECQ100-011. JEDEC document JEP155 states that 500V

HBM allows safe manufacturing with a standard ESD control

process. JEDEC document JEP157 states that 250V CDM

allows safe manufacturing with a standard ESD control

process.

4) The device is not guaranteed to function outside of its operating

conditions.

5) Operating devices at junction temperatures greater than 125°C

is possible; contact MPS for details.

6) Measured on EVQ7920-R-00A, 4-layer PCB.

7) Measured on JESD51-7, 4-

layer PCB. The value of θ

JA given

in this table is only valid for comparison with other packages

and cannot be used for design purposes. These values were

calculated in accordance with JESD51-7, and simulated on a

specified

JEDEC

board.

They

not

represent

the

performance obtained in an actual application.

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