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33937 Datasheet(PDF) 28 Page - Freescale Semiconductor, Inc |
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33937 Datasheet(HTML) 28 Page - Freescale Semiconductor, Inc |
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28 / 47 page ![]() Analog Integrated Circuit Device Data 28 Freescale Semiconductor 33937 FUNCTIONAL INTERNAL BLOCK DESCRIPTION In order to achieve a 100% duty cycle operation of the High Side external FETs, a fully integrated trickle charge pump provides the charge necessary to maintain the external FET gates at fully enhanced levels. The trickle charge pump has limited ability to supply external leakage paths while performing it’s primary function. The graphs in Figures 11 through 14 beginning on page 20 show the typical margin for supplying external current loads. These limits are based on maintaining the voltage at CBOOT at least 3.0 V greater than the voltage on the HS_S for that phase. If this voltage differential becomes less than 3.0 V, the corresponding high side FET will most likely not remain fully enhanced and the high side driver may malfunction due to insufficient bias voltage between CBOOT and HS_S. The slew rate of the external output FET is limited by the driver output impedance, overall (external and internal) gate resistance and the load capacitance. To ensure the Low Side FET is not turned on by a large positive dV/dt on the drain of the Low Side FET, the turn-on slew rate of the High Side should be limited. If the slew rate of the High Side is limited by the gate-drain capacitance of the High Side FET, then the displacement current injected into the Low Side gate drive output will be approximately the same value. Therefore, to ensure the Low Side drivers can be held off, the voltage drop across the Low Side gate driver must be lower than the threshold voltage of the Low Side FET (see Figure 17). Similarly, during large negative dV/dt, the High Side FET will be able to remain off if its gate drive Low Side switch, develops a voltage drop less than the threshold voltage of the High Side FET. The gate drive Low Side switch discharges the gate to the source. Additionally, during negative dV/dt the Low Side gate drive could be forced below ground. The Low Side FETs must not inject detrimental substrate currents in this condition. The occurrence of these cases depends on the polarity of the load current during switching. Figure 17. Positive DV/dt Transient DRIVER FAULT PROTECTION The 33937 IC integrates several protection mechanisms against various faults. The first of them is the Current Sense Amplifier with the Over-current Comparator. These two blocks are common for all three driver phases. Current Sense Amplifier This amplifier is usually connected as a differential amplifier (see Figure 9). It senses a current flowing through the external FETs as a voltage across the current sense resistor RSENSE. Since the amplifier common mode range does not extend below ground, it is necessary to use an external reference to permit measuring both positive and negative currents. The amplifier output can be monitored directly (e.g. by the microcontroller’s ADC) at the AMP_OUT pin, providing the means for closed loop control with the 33937. The output voltage is internally compared with the Over- current Comparator threshold voltage (see Figure 22). Over-current Comparator The amplified voltage across RSENSE is compared with the pre-set threshold value by the over-current comparator input. If the Current Sense Amplifier output voltage exceeds the threshold of the Over-current Comparator it would change the status of its output (OC_OUT pin) and the fault condition would be latched (see Figure 20). The occurrence of this fault would be signalled by the return value of the Status Register 0. If the proper Interrupt Mask has been set, this fault condition will generate an Phase x Output Phase Return Px_LS_S Px_LS_G Px_HS_S Low -Side Driver LS Control Px_LS_G Px_HS_G Deadtime -VD VSUP Phase x Output Voltage dV/dt CGS CDG CDS Rg iCDG VLS 33927 + - G S D Discrete FET Package Zo |
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