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TMS320DM335 Datasheet(PDF) 9 Page - Texas Instruments

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Part # TMS320DM335
Description  Digital Media System-on-Chip (DMSoC) Silicon Revision 1.1
PDF  26 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMS320DM335 Datasheet(HTML) 9 Page - Texas Instruments

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2.1.6
ASP: Transfers Should be Buffered in Internal Memory
2.1.7
ASP: Initialization Procedure When External Device is Frame-Sync Master
2.1.8
NAND Layout Assumed by RBL for Big Block NAND Does Not Match NAND Manufacturers'
www.ti.com
Silicon Revision 1.1 Usage Notes and Known Design Exceptions to Functional Specifications
In DM335 Silicon Revision 1.1, Audio Serial Port (ASP) transfers may need to originate and complete from
on-chip buffers in ARM Internal RAM (TCM). This is due to the fact that there is no tolerance for audio
data dropouts that may occur due to the delays in DDR2/mDDR accesses from other masters and from
unavoidable DDR2/mDDR refresh cycles even if the Q0/TC0 is dedicated to transfers from off-chip
memories. On-chip buffers might be needed to ensure immunity from DDR2/mDDR latencies.
DDR2/mDDR latencies are system-dependent, varying between applications, and are impacted by the
amount and type of data traffic to DDR2/mDDR memories. Once completed, the data can be shuttled
between the internal buffer and the DDR2/mDDR memory by using EDMA Q1/TC1.
If using on-chip buffers for ASP transfers, also see the following advisories:
• 1.1.2 Concurrent Access to ARM Internal Memory May Result in Access Errors
On DM335 Silicon Revision 1.1, if the ASP transmitter expects a frame sync from an external device, care
must be taken to ensure that the proper action is employed. After the transmitter comes out of reset
(XRST = 1), it waits for a frame sync from the external device. If the first frame sync arrives very shortly
after the transmitter is enabled, the CPU or EDMA controller may not have a chance to service the ASP
data transmit register (DXR). In this case, the transmitter shifts out the default data in the transmit shift
register (XSR) instead of the desired value, which has not yet arrived in the DXR. This causes problems in
some applications such that the first data element in the frame is invalid. The data stream appears
element-shifted (the first data word may appear in the second channel instead of the first).
To ensure proper operation when the external device is the frame master, you must make sure that the
DXR is already serviced with the first word when a frame sync occurs. To do so, you can keep the
transmitter in reset until the first frame sync is detected. The software is set up such that it will only take
the transmitter out of reset (XRST = 1) promptly after detecting the first frame sync. This ensures that the
transmitter does not begin data transfers at the data pin during the first frame-sync period. This also
provides almost an entire frame period for the DM335 device to service the DXR with the first word before
the second frame sync occurs. The transmitter only begins data transfers upon receiving the second
frame sync. At this point, the DXR is already serviced with the first word.
The ASP transmitter and receiver on the DM335 device are capable of generating an interrupt upon the
detection of frame synchronization. However, on the DM335 device, the receiver and/or transmitter must
be out of reset to enable this feature. Therefore, instead of directly using the ASP interrupt to detect the
first frame sync, on the DM335 device you can use the GPIO peripheral. This can be achieved by
connecting the frame-sync signal to a GPIO pin. The software can either poll the GPIO pin to detect the
first frame sync or program the GPIO peripheral to generate an interrupt to the CPU upon detecting the
first frame-sync edge. For more information on the GPIO peripheral, see the TMS320DM335 DMSoC
General-Purpose Input/Output (GPIO) User's Guide (SPRUFY8). For details on the initialization sequence
when the external device is the frame-sync master, see the TMS320DM335 DMSoC Audio Serial Port
(ASP) User's Guide (SPRUFZ3).
Recommendations
Typically NAND manufactures place Bad Block information in the spare bytes area. The RBL assumes a
data layout as below:
512 bytes Data
16 bytes ECC Data
512 bytes Data
16 bytes ECC Data
512 bytes Data
16 bytes ECC Data
512 bytes Data
16 bytes ECC Data
SPRZ287A – July 2008 – Revised October 2008
TMS320DM335 Digital Media System-on-Chip (DMSoC)
9
Silicon Revision 1.1
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