AD5293 datasheet(7/20 Pages) AD

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AD5293

Rev. 0 | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4

Parameter

Rating

VDD to GND

–0.3 V to +35 V

VSS to GND

+0.3 V to −16.5 V

VLOGIC to GND

–0.3 V to +7 V

VDD to VSS

35 V

VA, VB, VW to GND

VSS − 0.3 V, VDD + 0.3 V

IA, IB, IW

Pulsed1

Frequency >10 kHz

±3 mA/d2

Frequency ≤10 kHz

±3 mA/√d2

Continuous

±3 mA

Digital Input and Output Voltage to GND

–0.3 V to VLOGIC +0.3 V

EXT_CAP Voltage to GND

–0.3 V to +7 V

Operating Temperature Range

−40°C to +105°C

Maximum Junction Temperature (TJ max)

150°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Package Power Dissipation

(TJ max − TA)/θJA

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

14-Lead TSSOP

931

°C/W

1 JEDEC 2s2p test board, still air (from 0 m/sec to 1 m/sec of airflow).

ESD CAUTION

1 Maximum terminal current is bounded by the maximum current handling of

the switches, the maximum power dissipation of the package, and the maxi-

mum applied voltage across any two of the A, B, and W terminals at a given

resistance.

2 d = pulse duty factor.

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