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MAX17021 Datasheet(PDF) 44 Page - Maxim Integrated Products

Part # MAX17021
Description  Dual-Phase, Quick-PWM Controllers for IMVP-6/IMVP-6.5 CPU Core Power Supplies
PDF  48 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX17021 Datasheet(HTML) 44 Page - Maxim Integrated Products

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For most applications, nontantalum chemistries (ceram-
ic, aluminum, or OS-CON) are preferred due to their
resistance to inrush surge currents typical of systems
with a mechanical switch or connector in series with the
input. If the Quick-PWM controller is operated as the
second stage of a two-stage power-conversion system,
tantalum input capacitors are acceptable. In either con-
figuration, choose an input capacitor that exhibits less
than +10°C temperature rise at the RMS input current
for optimal circuit longevity.
Power-MOSFET Selection
Most of the following MOSFET guidelines focus on the
challenge of obtaining high load-current capability
when using high-voltage (> 20V) AC adapters. Low-
current applications usually require less attention.
The high-side MOSFET (NH) must be able to dissipate
the resistive losses plus the switching losses at both
VIN(MIN) and VIN(MAX). Calculate both these sums.
Ideally, the losses at VIN(MIN) should be approximately
equal to losses at VIN(MAX), with lower losses in
between. If the losses at VIN(MIN) are significantly high-
er than the losses at VIN(MAX), consider increasing the
size of NH (reducing RDS(ON) but with higher CGATE).
Conversely, if the losses at VIN(MAX) are significantly
higher than the losses at VIN(MIN), consider reducing
the size of NH (increasing RDS(ON) to lower CGATE). If
VIN does not vary over a wide range, the minimum
power dissipation occurs where the resistive losses
equal the switching losses.
Choose a low-side MOSFET that has the lowest possible
on-resistance (RDS(ON)), comes in a moderate-sized
package (i.e., one or two 8-pin SOs, DPAK, or D2PAK),
and is reasonably priced. Make sure that the DL_ gate
driver can supply sufficient current to support the gate
charge and the current injected into the parasitic gate-
to-drain capacitor caused by the high-side MOSFET
turning on; otherwise, cross-conduction problems might
occur (see the
MOSFET Gate Drivers section).
MOSFET Power Dissipation
Worst-case conduction losses occur at the duty factor
extremes. For the high-side MOSFET (NH), the worst-
case power dissipation due to resistance occurs at the
minimum input voltage:
where
ηTOTAL is the total number of phases.
Generally, a small high-side MOSFET is desired to
reduce switching losses at high input voltages.
However, the RDS(ON) required to stay within package
power dissipation often limits how small the MOSFET
can be. Again, the optimum occurs when the switching
losses equal the conduction (RDS(ON)) losses. High-
side switching losses do not usually become an issue
until the input is greater than approximately 15V.
Calculating the power dissipation in high-side MOSFET
(NH) due to switching losses is difficult since it must
allow for difficult quantifying factors that influence the
turn-on and turn-off times. These factors include the
internal gate resistance, gate charge, threshold volt-
age, source inductance, and PCB layout characteris-
tics. The following switching-loss calculation provides
only a very rough estimate and is no substitute for
breadboard evaluation, preferably including verification
using a thermocouple mounted on NH:
where COSS is the NH MOSFET’s output capacitance,
QG(SW) is the charge needed to turn on the NH
MOSFET, and IGATE is the peak gate-drive source/sink
current (2.2A typ).
Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied due to the squared term in the C x
VIN2 x ƒSW switching-loss equation. If the high-side
MOSFET chosen for adequate RDS(ON) at low-battery
voltages becomes extraordinarily hot when biased from
VIN(MAX), consider choosing another MOSFET with
lower parasitic capacitance.
For the low-side MOSFET (NL), the worst-case power
dissipation always occurs at maximum input voltage:
The worst case for MOSFET power dissipation occurs
under heavy overloads that are greater than
ILOAD(MAX) but are not quite high enough to exceed
PD N
sistive
V
V
L
OUT
IN MAX
(Re
)
()
=
⎛
⎝
⎜
⎞
⎠
⎟
⎡
⎣
⎢1-
⎢⎢
⎤
⎦
⎥
⎥
⎛
⎝⎜
⎞
⎠⎟
I
R
LOAD
TOTAL
DS ON
η
2
()
PD N Switching
VI
f
H
IN MAX LOAD SW
TOTAL
()
()
=
⎛
η
⎝⎝⎜
⎞
⎠⎟
⎛
⎝⎜
⎞
⎠⎟
+
Q
I
CV
f
GSW
GATE
OSS IN SW
()
2
2
PD N
sistive
V
V
I
H
OUT
IN
LOAD
TOTA
(Re
)
=
⎛
⎝⎜
⎞
⎠⎟ η
L
L
DS ON
R
⎛
⎝⎜
⎞
⎠⎟
2
()
Dual-Phase, Quick-PWM Controllers for
IMVP-6+/IMVP-6.5 CPU Core Power Supplies
44
______________________________________________________________________________________



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