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LT3757

3757fb

package DescripTion

MSOP (MSE) 0908 REV C

0.53 0.152

(.021 .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

1 2 3 4 5

4.90 0.152

(.193 .006)

0.497 0.076

(.0196 .003)

REF

7 6

3.00 0.102

(.118 .004)

(NOTE 3)

3.00 0.102

(.118 .004)

(NOTE 4)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0 – 6 TYP

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 0.127

(.035 .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305 0.038

(.0120 .0015)

TYP

2.083 0.102

(.082 .004)

2.794 0.102

(.110 .004)

0.50

(.0197)

BSC

BOTTOM VIEW OF

EXPOSED PAD OPTION

1.83 0.102

(.072 .004)

2.06 0.102

(.081 .004)

0.1016 0.0508

(.004 .002)

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.05 REF

0.29

REF

MSE Package

10-Lead Plastic MSOP, Exposed Die Pad

(ReferenceLTCDWG#05-08-1664RevC)

LT3757 Datasheet(PDF) 34 Page - Linear Technology

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