33812 datasheet(6/25 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33812

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

VPWR Supply Voltage(1)

VPWR

-0.3 to 45

VDC

Logic Input Voltage (MTX, INJIN, IGNIN, WDRFSH, LAMPIN, RIN)

VIL

-0.3 to VCC

VDC

Injector and RELAY Low Side Driver Drain Voltage (VINJOUT)

VINJOUT

VRELOUT

-0.3 to VCLAMP_INJ

-0.3 to VCLAMP_REL

VDC

Lamp Low Side Driver Drain Voltage (LAMPOUT)

LAMPOUT

-0.3 to VCLAMP_LAMP

VDC

Output Clamp Energy (INJOUT and ROUT) (Single Pulse)

TJUNCTION = 150°C, IOUT = 1.5 A

ECLAMP_INJ_SP

ECLAMP_REL_SP

100

Output Clamp Energy (INJOUT and ROUT) (Continuous operation)

TJUNCTION = 125°C, IOUT = 1.0 A, (Max. frequency is 70 Hz, Maximum Duty Cycle 90%)

ECLAMP_INJ_CP

ECLAMP_REL_CP

100

Output Continuous Current (INJOUT and ROUT)

TJUNCTION = 150°C

IOCC_MAX

2.0

Output Clamp Energy (LAMPOUT) (Single Pulse) - TJUNCTION = 150°C, IOUT = 0.5 A ECLAMP_LAMP_SP

ESD Voltage(2)

Human Body Model

Machine Model

Charge Device Model (Corner pins)

Charge Device Model

VESD1

VESD2

VESD3

VESD4

±2000

±200

±750

±500

THERMAL RATINGS

Operating Temperature

Ambient

Junction

Case

-40 to 125

-40 to 150

-40 to 125

°C

Storage Temperature

TSTG

-55 to 150

°C

Power Dissipation (TA = 25°C)

(5)

1.7

Peak Package Reflow Temperature During Solder Mounting(3), (4)

TSOLDER

Note 4

°C

Thermal Resistance

Junction-to-Ambient

Junction- to-Lead

Junction-to-Flag

RθJA

RθJL

RθJC

8.0

1.2

°C/W

Notes

Exceeding these limits may cause malfunction or permanent damage to the device.

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)

(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.

This parameter is guaranteed by design but is not production tested.

33812 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

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