UBA2071_A_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 23 June 2008

24 of 35

NXP Semiconductors

UBA2071; UBA2071A

Half bridge control IC for CCFL backlighting

10. Thermal characteristics

11. Characteristics

voltage on pin NONFAULT

−0.1

+5

V

voltage on pin VFB

continuous

−0.1

+5

V

t < 1 ms

−0.1

+9

V

voltage on pin IFB

continuous

−5+5

V

t < 1 ms

−9+9

V

ESD

electrostatic discharge voltage

human body model:

pins IFB, CIFB, VFB, CVFB,

CSWP, IREF, CT, CF, CPWM,

NONFAULT, COMM, PWMA,

PWMD, EN, VDD, and GL

−2+2

kV

pins GH, FS, and SH

−1+1

kV

machine model:

all pins

−250

+250

V

Table 4.

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to signal

ground (SGND pin 10).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

thermal resistance from

junction to ambient

in free air; SO24 package

80

K/W

in free air; SSOP24 package

111

K/W

Table 6.

Characteristics

voltages are measured with respect to signal ground (SGND, pin 10). SGND and PGND connected together. GL, GH,

COMM, NONFAULT and PWMD pins left open (unless otherwise specified). Currents are positive when flowing into the IC.

Parameters valid for all types (unless otherwise specified).

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

High voltage

leakage current

--2

µA

Start-up

VDD start-up voltage

UBA2071T and UBA2071TS

11.7

12.1

12.5

V

UBA2071AT and UBA2071ATS

10.5

10.9

11.3

V

stop voltage on pin VDD

9.8

10.1

10.4

V

hysteresis voltage on pin VDD

UBA2071T and UBA2071TS

1.8

2

2.2

V

UBA2071AT and UBA2071ATS

0.6

0.8

1.0

V

start-up current on pin VDD

0.13

0.16

0.19

mA