ADP5042 datasheet(7/32 Pages) AD

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ADP5042

Rev. 0 | Page 7 of 32

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

AVIN, VINx, VOUTx, ENx, MODE, MR

−0.3 V to +6 V

, WDIx,

WMOD, WSTAT, nRSTO to GND

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

ESD Human Body Model

3000 V

ESD Charged Device Model

1500 V

ESD Machine Model

100 V

Stresses above those listed under absolute maximum ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP5042 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

guarantee that the junction temperature is within the specified

temperature limits. In applications with high power dissipation

and poor thermal resistance, the maximum ambient

temperature may have to be derated. In applications with

moderate power dissipation and low PCB thermal resistance,

the maximum ambient temperature can exceed the maximum

limit as long as the junction temperature is within specification

limits. The junction temperature of the device is dependent on

the ambient temperature, the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package. Maximum junction temperature is calculated from the

ambient temperature and power dissipation using the formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The specified

value of θJA is based on a four-layer, 4” × 3”, 2.5 oz copper board,

as per JEDEC standard. For additional information, see the

AN-772 Application Note, A Design and Manufacturing Guide

for the Lead Frame Chip Scale (LFCSP).

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

Unit

20-Lead, 0.5 mm pitch LFCSP

4.2

°C/W

ESD CAUTION

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