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EM773 Datasheet(PDF) 45 Page - NXP Semiconductors |
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EM773 Datasheet(HTML) 45 Page - NXP Semiconductors |
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45 / 51 page ![]() EM773 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 3 January 2012 45 of 51 NXP Semiconductors EM773 Energy metering IC Fig 27. Package outline (HVQFN33 7x7) References Outline version European projection Issue date IEC JEDEC JEITA - - - hvqfn33_po 09-03-17 09-03-23 Unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.2 7.1 7.0 6.9 4.85 4.70 4.55 7.1 7.0 6.9 0.65 4.55 0.75 0.60 0.45 0.1 A(1) Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm A1 b 0.35 0.28 0.23 cD(1) Dh E(1) Eh 4.85 4.70 4.55 ee1 e2 4.55 Lv 0.1 w 0.05 y 0.08 y1 0 2.5 5 mm scale terminal 1 index area B A D E C y C y1 X detail X A1 A c b e2 e1 e e A C B v C w terminal 1 index area Dh Eh L 9 16 32 33 25 17 24 8 1 |
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