EM773 datasheet(46/51 Pages) PHILIPS

Part #	EM773

Description	Energy metering IC; up to 32 kB flash and 8 kB SRAM

PDF	51 Pages

Scroll/Zoom	100%

Manufacturer	PHILIPS [NXP Semiconductors]

Direct Link	http://www.nxp.com

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46 / 51 page

EM773

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Product data sheet

Rev. 2 — 3 January 2012

46 of 51

NXP Semiconductors

EM773

Energy metering IC

13. Soldering

Fig 28. Reflow soldering of the HVQFN33 package

Footprint information for reflow soldering of HVQFN33 package

001aao134

occupied area

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

Remark:

Stencil thickness: 0.125 mm

e = 0.65

evia = 4.25

OwDtot = 5.10 OA

PID = 7.25 PA+OA

OID = 8.20 OA

0.20 SR

chamfer (4×)

W = 0.30 CU

evia = 2.40

LbD = 5.80 CU

LaD = 7.95 CU

DHS = 4.85 CU

4.55 SR

B-side

(A-side fully covered)

number of vias: 20

Solder resist

covered via

0.30 PH

0.60 SR cover

0.60 CU

SDhtot = 2.70 SP

0.45 DM

SPD = 1.00 SP

GapD = 0.70 SP

EM773 Datasheet(PDF) 46 Page - NXP Semiconductors

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