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LPC1850 Datasheet(PDF) 138 Page - NXP Semiconductors |
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LPC1850 Datasheet(HTML) 138 Page - NXP Semiconductors |
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138 / 157 page ![]() LPC1850_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Preliminary data sheet Rev. 3 — 6 December 2011 138 of 157 NXP Semiconductors LPC1850/30/20/10 32-bit ARM Cortex-M3 microcontroller Fig 49. Reflow soldering of the LQFP208 package SOT459-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP208 package Ax Bx Gx Gy Hy Hx Ay By P1 P2 D2 (8 ×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy P1 P2 C sot459-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 31.300 31.300 28.300 28.300 0.500 0.560 0.280 1.500 0.400 28.500 28.500 31.550 31.550 |
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