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LPC1850 Datasheet(PDF) 136 Page - NXP Semiconductors |
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LPC1850 Datasheet(HTML) 136 Page - NXP Semiconductors |
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136 / 157 page ![]() LPC1850_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Preliminary data sheet Rev. 3 — 6 December 2011 136 of 157 NXP Semiconductors LPC1850/30/20/10 32-bit ARM Cortex-M3 microcontroller 15. Soldering Fig 47. Reflow soldering of the LBGA256 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT740-2 solder land plus solder paste occupied area Footprint information for reflow soldering of LBGA256 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot740-2_fr 1.00 0.450 0.450 0.600 17.500 17.500 |
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