AM3359 datasheet(135/195 Pages) TI

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AM3359, AM3358, AM3357

AM3356, AM3354, AM3352

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SPRS717B

– OCTOBER 2011 – REVISED JANUARY 2012

Complete stackup specifications are provided in Table 5-27.

Table 5-27. PCB Stackup Specifications(1)

NO.

PARAMETER

MIN

TYP

MAX

UNIT

PCB routing/plane layers

Signal routing layers

Full ground layers under LPDDR routing region

Number of ground plane cuts allowed within LPDDR routing region

Full VDDS_DDR power reference layers under LPDDR routing region

Number of layers between LPDDR routing layer and reference ground

plane

PCB routing feature size

mils

PCB trace width, w

mils

PCB BGA escape via pad size(2)

mils

PCB BGA escape via hole size(2)

mils

ZCZ package

0.5

AM335x BGA pad size

ZCE package

0.4

Single-ended impedance, Zo(3)

ohms

Impedance control(4)(5)

Zo-5

Zo+5

ohms

(1) For the LPDDR device BGA pad size, see the LPDDR device manufacturer documentation.

(2) A 20/10 via may be used if enough power routing resources are available. An 18/10 via allows for more flexible power routing to the

AM335x device.

(3) Zo is the nominal singled-ended impedance selected for the PCB.

(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo

defined by the single-ended impedance parameter.

(5) Tighter impedance control is required to ensure flight time skew is minimal.

Peripheral Information and Timings

135

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