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AM3359 Datasheet(PDF) 147 Page - Texas Instruments

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Part # AM3359
Description  AM335x ARM짰 Cortex??A8 Microprocessors (MPUs)
PDF  195 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM3359 Datasheet(HTML) 147 Page - Texas Instruments

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A1
A1
X
Y
OFFSET
Recommended DDR2
Device Orientation
Y
Y
OFFSET
DDR2
Device
AM335x
AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
www.ti.com
SPRS717B
– OCTOBER 2011 – REVISED JANUARY 2012
5.4.2.2.2.4 Placement
Figure 5-36 shows the required placement for the DDR2 devices. The dimensions for this figure are
defined in Table 5-40. The placement does not restrict the side of the PCB on which the devices are
mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the
placement.
Figure 5-36. AM335x Device and DDR2 Device Placement
Table 5-40. Placement Specifications(1)
NO.
PARAMETER
MIN
MAX
UNIT
1
X(2)(3)
1750
mils
2
Y(2)(3)
1280
mils
3
Y Offset(2)(3)(4)
650
mils
4
Clearance from non-DDR2 signal to DDR2 keepout region(5)(6)
4
w
(1) DDR2 keepout region to encompass entire DDR2 routing area.
(2) For dimension definitions, see Figure 5-36.
(3) Measurements from center of AM335x device to center of DDR2 device.
(4) For single-memory systems, it is recommended that Y offset be as small as possible.
(5) w is defined as the signal trace width.
(6) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
Copyright
© 2011–2012, Texas Instruments Incorporated
Peripheral Information and Timings
147
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Product Folder Link(s): AM3359 AM3358 AM3357 AM3356 AM3354 AM3352



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