LD6806 datasheet(24/36 Pages) PHILIPS

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LD6806_SER

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Product data sheet

Rev. 3 — 9 December 2011

24 of 36

NXP Semiconductors

LD6806 series

Ultra low-dropout regulator, low noise, 200 mA

14. Soldering of WLCSP packages

14.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface

mount reflow soldering description”.

Wave soldering is not suitable for this package.

Fig 41. SOT753 (TSOP5); Reflow soldering footprint

Fig 42. SOT753 (TSOP5); Wave soldering footprint

solder lands

solder resist

occupied area

solder paste

sot753_fr

2.825

3.3

0.45

×)

0.55

×)

0.7

×)

0.8

×)

3.45

1.95

0.95

2.4

Dimensions in mm

sot753_fw

5.3

5.05

0.45

1.5

×)

1.45

×)

2.85

1.475

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

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