ADF4351 datasheet(28/28 Pages) AD

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ADF4351

Data Sheet

Rev. 0 | Page 28 of 28

OUTLINE DIMENSIONS

3.25

3.10 SQ

2.95

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

COPLANARITY

0.08

3.50 REF

0.50

BSC

PIN 1

INDICATOR

PIN 1

INDICATOR

0.30

0.25

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

0.50

0.40

0.30

5.00

BSC SQ

4.75

BSC SQ

0.60 MAX

0.25 MIN

TOP VIEW

EXPOSED

PAD

BOTTOM VIEW

Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF4351BCPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-2

ADF4351BCPZ-RL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-2

EVAL-ADF4351EB1Z

Evaluation Board

1 Z = RoHS Compliant Part.

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D09800-0-5/12(0)

ADF4351 Datasheet(PDF) 28 Page - Analog Devices

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