WM8352 datasheet(334/336 Pages) WOLFSON

334 / 336 page

WM8352

Production Data

PD, February 2011, Rev 4.4

334

30 PACKAGE DIAGRAM

DM040.B

B: 129 BALL BGA PLASTIC PACKAGE 7 X 7 X 0.94 mm BODY, 0.50 mm BALL PITCH

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.

3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.

4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

8. FALLS WITHIN JEDEC, MO-195

0.28

0.24

0.2

0.35

0.25

7.00 BSC

6.00 BSC

0.50 BSC

7.00 BSC

6.00 BSC

0.30

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.83

0.94

1.05

0.63

0.70

0.77

0.10

aaa

bbb

ccc

0.08

0.15

Tolerances of Form and Position

ddd

0.05

ccc

DETAIL 1

SOLDER BALL

ddd

DETAIL 2

aaa

bbb

CORNER

TOP VIEW

0.10

2 X

DETAIL 2

0.10

2 X

DETAIL 1

BOTTOM VIEW

98765

SIDE VIEW

REF:

JEDEC, MO-195

WM8352 Datasheet(PDF) 334 Page - Wolfson Microelectronics plc

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