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CY8C54LP Datasheet(PDF) 112 Page - Cypress Semiconductor |
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CY8C54LP Datasheet(HTML) 112 Page - Cypress Semiconductor |
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112 / 117 page  PRELIMINARY PSoC® 5LP: CY8C54LP Family Datasheet Document Number: 001-84934 Rev. ** Page 112 of 117 13. Packaging Figure 13-1. 68-Pin QFN 8 × 8 with 0.4 mm Pitch Package Outline (Sawn Version) Table 13-1. Package Characteristics Parameter Description Conditions Min Typ Max Units TA Operating ambient temperature –40 25 85 °C TJ Operating junction temperature –40 – 100 °C TJA Package θJA (68-pin QFN) – 15 – °C/Watt TJA Package θJA (100-pin TQFP) – 34 – °C/Watt TJC Package θJC (68-pin QFN) – 13 – °C/Watt TJC Package θJC (100-pin TQFP) – 10 – °C/Watt Table 13-2. Solder Reflow Peak Temperature Package Maximum Peak Temperature Maximum Time at Peak Temperature 68-pin QFN 260 °C 30 seconds 100-pin TQFP 260 °C 30 seconds Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package MSL 68-pin QFN MSL 3 100-pin TQFP MSL 3 001-09618 *E |
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