IN

EN

CP

GND(CP)

OUT

SET

FB

GND

OUT

OUT(FB)

IN

IN(CP)

Exposed Pad

on Bottom

(DAP)

1

2

3

4

5

6

7

8

9

10

11

12

LP38798

SNOSCT6A – MARCH 2013 – REVISED MAY 2013

www.ti.com

Connection Diagram

Top View

Connect WSON DAP to GND at Pins 6 and 7

Figure 1. LP38798SD-ADJ

12-Lead WSON Package (Top View)

PIN DESCRIPTIONS

Pin

Name

Function

1, 2

IN

Device unregulated input voltage pins. Connect pins together at the package.

3

IN(CP)

Charge pump input voltage pin. Connect directly to pins 1 and 2 at the package.

Charge pump output. See Charge Pump section in the Applications Information

4

CP

for more information.

Enable pin. A Logic high level is required on this pin to enable the LDO output.

A Logic low level will turn the output off and reduce the operating current of the

5

EN

device. See Enable Input Operation section in the Applications Information for

more information.

6

GND

Device charge pump ground pin.

7

GND

Device analog ground pin.

8

FB

Feedback pin for programming the output voltage.

Internally filtered pre-buffered output. A feedback resistor divider network from

9

SET

this pin to FB and GND will set the output voltage of the device.

10

OUT(FB)

OUT buffer feedback pin. Connect directly to pins 11 and 12 at the package.

11, 12

OUT

Device regulated output voltage pins. Connect pins together at the package.

The exposed die attach pad on the bottom of the package should be connected

to a thermal pad at ground potential. See 12-Lead WSON Package Thermal

Exposed Pad

DAP

Considerations section in the APPLICATIONS INFORMATION for more

information.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

2

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: LP38798