AD9681 datasheet(12/40 Pages) AD

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AD9681

Data Sheet

Rev. A | Page 12 of 40

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to GND

−0.3 V to +2.0 V

DRVDD to GND

−0.3 V to +2.0 V

Digital Outputs (D0±xx, D1±xx, DCO±1,

DCO±2, FCO±1, FCO±2) to GND

−0.3 V to +2.0 V

CLK+, CLK− to GND

−0.3 V to +2.0 V

VIN±x1, VIN±x2 to GND

−0.3 V to +2.0 V

SCLK/DTP, SDIO/OLM, CSB1, CSB2 to GND

−0.3 V to +2.0 V

SYNC, PDWN to GND

−0.3 V to +2.0 V

RBIAS1, RBIAS2 to GND

−0.3 V to +2.0 V

VREF, VCM1, VCM2, SENSE to GND

−0.3 V to +2.0 V

Environmental

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

Typical θJAis specified for a 4-layer PCB with a solid ground plane.

Airflow improves heat dissipation, which reduces θJA. In addition,

metal in direct contact with the package leads from metal traces,

through holes, ground, and power planes reduces θJA.

Table 7. Thermal Resistance (Simulated)

Package Type

Airflow

Velocity

(m/sec)

θJA1, 2



1, 2

Unit

144-Ball, 10 mm × 10 mm

CSP-BGA

30.2

0.13

°C/W

1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

ESD CAUTION

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