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AS3911 Datasheet(PDF) 7 Page - ams AG |
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AS3911 Datasheet(HTML) 7 Page - ams AG |
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7 / 149 page  ams Datasheet, Confidential: 2013-Oct [2-03] AS3911 – 7 Abs o lute M a ximum R a tings Tbody Package body temperature 260 °C Norm: IPC/JEDEC J-STD-020. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is matte tin (100% Sn). Humidity non-condensing 585 % MSL Moisture Sensitive Level 3 Represents a max. floor life time of 168h Thermal Resistance θja Theta ja 36.4 C/W @ 85°C room temperature Symbol Parameter Min Max Unit Comments |
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