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OPA2832 Datasheet(PDF) 27 Page - National Semiconductor (TI) |
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OPA2832 Datasheet(HTML) 27 Page - National Semiconductor (TI) |
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27 / 37 page ![]() INPUT AND ESD PROTECTION External Pin +V CC −V CC Internal Circuitry OPA2832 www.ti.com ............................................................................................................................................. SBOS327C – FEBRUARY 2005 – REVISED AUGUST 2008 d) Connections to other wideband devices on the e) Socketing a high-speed part is not board may be made with short direct traces or recommended. The additional lead length and through onboard transmission lines. For short pin-to-pin capacitance introduced by the socket can connections, consider the trace and the input to the create an extremely troublesome parasitic network next device as a lumped capacitive load. Relatively which can make it almost impossible to achieve a wide traces (50mils to 100mils) should be used, smooth, stable frequency response. Best results are preferably with ground and power planes opened up obtained by soldering the OPA2832 onto the board. around them. Estimate the total capacitive load and set RS from the typical characteristic curve Recommended RS vs Capacitive Load. Low parasitic The OPA2832 is built using a very high-speed capacitive loads (< 5pF) may not need an RS since complementary bipolar process. The internal junction the OPA2832 is nominally compensated to operate breakdown voltages are relatively low for these very with a 2pF parasitic load. Higher parasitic capacitive small geometry devices. These breakdowns are loads without an RS are allowed as the signal gain reflected in the Absolute Maximum Ratings table. All increases (increasing the unloaded phase margin). If device pins are protected with internal ESD protection a long trace is required, and the 6dB signal loss diodes to the power supplies, as shown in Figure 72. intrinsic to a doubly-terminated transmission line is acceptable, implement a matched impedance transmission line using microstrip or stripline techniques (consult an ECL design handbook for microstrip and stripline layout techniques). A 50 Ω environment is normally not necessary onboard, and in fact, a higher impedance environment will improve distortion as shown in the distortion versus load plots. With a characteristic board trace impedance defined (based on board material and trace dimensions), a matching series resistor into the trace from the output of the OPA2832 is used as well as a terminating Figure 72. Internal ESD Protection shunt resistor at the input of the destination device. Remember also that the terminating impedance will These diodes provide moderate protection to input be the parallel combination of the shunt resistor and overdrive voltages above the supplies as well. The the input impedance of the destination device; this protection diodes can typically support 30mA total effective impedance should be set to match the continuous current. Where higher currents are trace impedance. If the 6dB attenuation of a possible (that is, in systems with ±15V supply parts doubly-terminated transmission line is unacceptable, driving into the OPA2832), current-limiting series a long trace can be series-terminated at the source resistors should be added into the two inputs. Keep end only. Treat the trace as a capacitive load in this these resistor values as low as possible, since high case and set the series resistor value as shown in the values degrade both noise performance and typical characteristic curve Recommended RS vs frequency response. Capacitive Load. This will not preserve signal integrity as well as a doubly-terminated line. If the input impedance of the destination device is low, there will be some signal attenuation due to the voltage divider formed by the series output into the terminating impedance. Copyright © 2005–2008, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Link(s): OPA2832 |
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