THS4524MDBTREP datasheet(4/48 Pages) NSC

4 / 48 page

THS4524-EP

SBOS609A – JUNE 2012 – REVISED AUGUST 2013

www.ti.com

THERMAL INFORMATION

THS4524

THERMAL METRIC(1)

DBT

UNITS

38 PINS

θJA

Junction-to-ambient thermal resistance(2)

106.9

θJCtop

Junction-to-case (top) thermal resistance(3)

59.8

θJB

Junction-to-board thermal resistance(4)

66.5

°C/W

ψJT

Junction-to-top characterization parameter(5)

17.1

ψJB

Junction-to-board characterization parameter(6)

66.1

θJCbot

Junction-to-case (bottom) thermal resistance(7)

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

ELECTRICAL CHARACTERISTICS: VS+ – VS– = 3.3 V

At VS+ = +3.3 V, VS– = 0 V, VOCM = open, VOUT = 2 VPP (differential), RL = 1 kΩ differential, G = 1 V/V, single-ended input,

differential output, and input and output referenced to midsupply, unless otherwise noted.

TA = -55°C to 125°C

TEST

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

LEVEL(1)

AC PERFORMANCE

Small-Signal Bandwidth

VOUT = 100 mVPP, G = 1

135

MHz

VOUT = 100 mVPP, G = 2

MHz

VOUT = 100 mVPP, G = 5

18.6

MHz

VOUT = 100 mVPP, G = 10

9.3

MHz

Gain Bandwidth Product

VOUT = 100 mVPP, G = 10

MHz

Large-Signal Bandwidth

VOUT = 2 VPP, G = 1

MHz

Bandwidth for 0.1-dB Flatness

VOUT = 2 VPP, G = 1

MHz

Rising Slew Rate (Differential)