11

®

NIC COMPONENTS CORP. www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

Specifications are subject to change

REEL DIMENSIONS (mm)

Parts with a thickness of >1mm will be taped on embossed

plastic carrier. Parts with a thickness of less then 1mm

will be taped on paper carrier

CARRIER TAPE MATERIAL

NMA Series

Automotive Grade Ceramic Chip Capacitors

C

T

A

REEL

Reel Diameter (A)

B

C

D

T max.

7” (178 + 0/- 0.3)

13 ± 0.3 80 +1/-0 21 ± 1.0 9.0 ± 0.5

13” (330 + 0/- 0.3)

RECOMMENDED SOLDERING METHOD

Dielectric

Case

Size

Capacitance

Value

Soldering Method

Flow

Reflow

NPO

All

All

O

O

X7R

0603

< 1

μFO

O

>1

μF

-

O

0805

< 4.7

μFO

O

> 4.7

μF

-

O

1206

< 10

μFO

O

Reflow Soldering Profile

Peak +260°C +0/-5°C for 10 sec. max.

Gradual

Cooling

Preheat

60 ~ 120 Sec.

60 ~ 150 Sec.

Heating

260

217

200

150

Time

Temp. Rise

Flow Soldering Profile

5 sec. max.

260 ± 3°C

Δ T 1206 and smaller

150°C max.

Time