HCPL-0870 datasheet(11/28 Pages) HP

11 / 28 page

1-270

Figure 13. Dependence of Safety-

Limiting Values on Temperature.

Insulation and Safety Related Specifications

Parameter

Symbol Value

Units

Conditions

Minimum External Air Gap

L(I01)

7.4

Measured from input terminals to output

(Clearance)

terminals, shortest distance through air.

Minimum External Tracking

L(I02)

8.0

Measured from input terminals to output

(Creepage)

terminals, shortest distance path along body

Minimum Internal Plastic Gap

0.5

Insulation thickness between emitter and

(Internal Clearance)

detector; also known as distance through

insulation.

Tracking Resistance

CTI

175

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

-55

125

°C

Ambient Operating Temperature

-40

+85

°C

Supply Voltages

VDD1, VDD2

5.5

Volts

Steady-State Input Voltage

VIN+, VIN-

-2.0

VDD1 + 0.5

Volts

Two Second Transient Input Voltage

-6.0

Output Voltages

MCLK, MDAT

-0.5

VDD2 +0.5

Volts

Lead Solder Temperature

260

°C for 10 sec., 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Maximum Solder Reflow Thermal Profile section

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Note

Ambient Operating Temperature

-40

+85

°C

Supply Voltages

VDD1, VDD2

4.5

5.5

Input Voltage

VIN+, VIN-

-200

+200

TA – TEMPERATURE – °C

150

100

300

100

150

MAX. OPERATING

TEMP. IS 100 °C

200

PSi, OUTPUT

250

200

PSi, INPUT

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