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HCPL-0870 Datasheet(PDF) 27 Page - Agilent(Hewlett-Packard) |
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HCPL-0870 Datasheet(HTML) 27 Page - Agilent(Hewlett-Packard) |
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27 / 28 page ![]() 1-286 Table 9. Isotek (Isabellenhütte) Four-Terminal Shunt Summary. Shunt Maximum Motor Power Range Resistance Tol. RMS Current 120 Vac-440 Vac Part Number m Ω %A hp kW PBV-R050-0.5 50 0.5 3 0.8-3 0.6-2 PBV-R020-0.5 20 0.5 7 2-7 1.4-5 PBV-R010-0.5 10 0.5 14 4-14 3-10 PBV-R005-0.5 5 0.5 25 [28] 7-25 [8-28] 5-19 [6-21] PBV-R002-0.5 2 0.5 39 [71] 11-39 [19-71] 8-29 [14-53] Note: Values in brackets are with a heatsink for the shunt. drops across the leads carrying the load current should have no impact on the measured voltage. Several four-terminal shunts from Isotek (Isabellenhütte) suitable for sensing currents in motor drives up to 71 Arms (71 hp or 53 kW) are shown in Table 9; the maximum current and motor power range for each of the PBV- series shunts are indicated. For shunt resistances from 50 m Ω down to 10 m Ω, the maximum current is limited by the input voltage range of the isolated modulator. For the 5 m Ω and 2m Ω shunts, a heat sink may be required due to the increased power dissipation at higher currents. When laying out a PC board for the shunts, a couple of points should be kept in mind. The Kelvin connections to the shunt should be brought together under the body of the shunt and then run very close to each other to the input of the isolated modula- tor; this minimizes the loop area of the connection and reduces the possibility of stray magnetic fields from interfering with the measured signal. If the shunt is not located on the same PC board as the isolated modulator circuit, a tightly twisted pair of wires can accomplish the same thing. Also, multiple layers of the PC board can be used to increase current carrying capacity. Numerous plated-through vias should surround each non-Kelvin terminal of the shunt to help distribute the current between the layers of the PC board. The PC board should use 2 or 4 oz. copper for the layers, resulting in a current carrying capacity in excess of 20 A. Making the current carrying traces on the PC board fairly large can also improve the shunt’s power dissipation capability by acting as a heat sink. Liberal use of vias where the load current enters and exits the PC board is also recommended. Shunt Connections The recommended method for connecting the isolated modula- tor to the shunt resistor is shown in Figure 21. VIN+ (pin 2 of the HPCL-7860) is connected to the positive terminal of the shunt resistor, while VIN- (pin 3) is shorted to GND1 (pin 4), with the power-supply return path func- tioning as the sense line to the negative terminal of the current shunt. This allows a single pair of wires or PC board traces to connect the isolated modulator circuit to the shunt resistor. By referencing the input circuit to the negative side of the sense resistor, any load current induced noise transients on the shunt are seen as a common-mode signal and will not interfere with the current-sense signal. This is important because the large load currents flowing through the motor drive, along with the parasitic inductances inherent in the wiring of the circuit, can generate both noise spikes and offsets that are relatively large compared to the small voltages that are being measured across the current shunt. If the same power supply is used both for the gate drive circuit and for the current sensing circuit, it is very important that the connec- tion from GND1 of the isolated modulator to the sense resistor be the only return path for supply current to the gate drive power supply in order to eliminate potential ground loop problems. The only direct con- nection between the isolated modulator circuit and the gate drive circuit should be the positive power supply line. Shunt Resistor |
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