HCPL-0870 datasheet(16/28 Pages) HP

16 / 28 page

1-275

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

-55

+125

°C

Ambient Operating Temperature

-40

+85

°C

Supply Voltage

VDD

5.5

Input Voltage

All Inputs

-0.5

VDD + 0.5

Output Voltage

All Outputs

-0.5

VDD + 0.5

Lead Solder Temperature

260

°C for 10 seconds, 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Reflow Thermal Profile

Note:

17. HP recommends the use of non-chlorinated solder fluxes.

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Note

Ambient Operating Temperature

-40

+85

°C

Supply Voltage

VDD

4.5

5.5

Input Voltage

All Inputs

VDD

Maximum Solder Reflow Thermal Profile

240

∆T = 115°C, 0.3°C/SEC

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

260

456789

(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)

HCPL-0870 Datasheet(PDF) 16 Page - Agilent(Hewlett-Packard)

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