PCM186X datasheet(8/115 Pages) TI1

8 / 115 page

PCM1860, PCM1862, PCM1864, PCM1864-Q1

SLASE55A – NOVEMBER 2014 – REVISED DECEMBER 2014

www.ti.com

8 Specifications

8.1 Absolute Maximum Ratings

over operating temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

AVDD to AGND

–0.3

3.9

Supply voltage

DVDD to DGND

–0.3

3.9

IOVDD to DGND

–0.3

3.9

Ground voltage

AGND, DGND

–0.3

0.3

differences

Digital input voltage

to DGND

–0.3

IOVDD + 0.3

to DGND

–0.3

2.1

Analog input voltage

VINxx

-1.7

5.0

Tstg

Storage Temperature

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

pins(1)

Electrostatic

V(ESD)

discharge

Charged device model (CDM), per JEDEC specification JESD22-

±1500

C101, all pins

(1)

Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows

safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Analog supply voltage

AVDD to AGND

3.0

3.3

3.6

Digital supply voltage

DVDD to DGND

3.0

3.3

3.6

IO supply voltage to DGND

IOVDD at 1.8V to DGND

1.62

1.8

1.98

IO supply voltage to DGND

IOVDD at 3.3V to DGND

3.0

3.3

3.6

LDO is an input when using external 1.8V power

LDO to DGND

IOVDD – 0.3

IOVDD

IOVDD + 0.3

supply

Operating junction temperature range

–40

125

°C

8.4 Thermal Information

over operating temperature range (unless otherwise noted)

DBT

THERMAL METRIC(1)

UNIT

(30 PINS)

RθJA

Junction-to-ambient thermal resistance (2)

91.2

ψJT

Junction-to-top characterization parameter

1.0

ψJB

Junction-to-board characterization parameter

41.5

ºC/W

RθJC

Junction-to-case (top) thermal resistance

25.3

RθJB

Junction-to-board thermal resistance

42.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

High K (High Thermal Conductivity, Multilayer Circuit Board)

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Product Folder Links: PCM1860 PCM1862 PCM1864 PCM1864-Q1

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