Layout thermal considerations

AN2620

18/20

Doc ID 13883 Rev 3

5

Layout thermal considerations

The leadframe die pad of the ST1S10 is exposed at the bottom of the package and must be

soldered directly to a properly designed thermal pad on the PCB (ground copper area used

as a heat sink).

The addition of thermal vias from the thermal pad to an internal or bottom ground plane

helps to increase the power dissipation.