AN3338 datasheet(69/72 Pages) STMICROELECTRONICS

69 / 72 page

Doc ID 18441 Rev 4

69/72

AN3338

Design and mounting guidelines

The SLLIMM is an ESD sensitive device, it may be damaged in the case of ESD shocks. All

equipment used to handle power modules must comply with ESD standards including

transportation, storage, and assembly.

Transportation

Be careful when handling the SLLIMM and packaging material. Ensure that the module is

not subjected to mechanical vibration or shock during transport. Do not toss or drop to

ensure the SLLIMM is correctly functioning before boarding. Wet conditions are dangerous

and moisture can also adversely affect the packaging. Hold the package avoiding touching

the leads during mounting. Put package boxes upside down, leaning them or giving them

uneven stress may cause the terminals to be deformed or the resin to be damaged.

Throwing or dropping the packaging boxes may cause the modules to be damaged. Wetting

the packaging boxes may cause the breakdown of modules when operating. Pay particular

care when transporting in wet conditions.

Storage

•

Do not force or load the external pressure to the modules while they are in storage

•

Humidity should be kept within the range of 40% to 75%, the temperature should not go

over 35 °C or below 5 °C

•

Lead solder ability is degraded by lead oxidation or corrosion. So using storage areas

where there is minimal temperature fluctuation is highly recommended

•

The presence of harmful gases or dusty conditions is not acceptable for storage.

•

Use antistatic containers

Electrical shock and thermal injury

•

Do not touch either module or heatsink when SLLIMM is operating to avoid sustaining

an electrical shock and/or a burn injury.

AN3338 Datasheet(PDF) 69 Page - STMicroelectronics