LT3477

19

3477fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

FE Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation CB

FE20 (CB) TSSOP 0204

0.09 – 0.20

(.0035 – .0079)

0

° – 8°

0.25

REF

RECOMMENDED SOLDER PAD LAYOUT

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

13

4

5

6 7 89 10

11

12

14 13

6.40 – 6.60*

(.252 – .260)

3.86

(.152)

2.74

(.108)

20 1918 17 16 15

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

2

2.74

(.108)

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

3.86

(.152)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC