µPD78001B(A), 78002B(A)

5

1.

PIN CONFIGURATION (TOP VIEW) .....................................................................................................

6

2.

BLOCK DIAGRAM ...................................................................................................................................

9

3.

PIN FUNCTIONS ..................................................................................................................................... 10

3.1

PORT PINS ...................................................................................................................................................... 10

3.2

OTHER PINS ................................................................................................................................................... 12

3.3

PIN I/O CIRCUIT AND RECOMMENDED CONNECTION OF UNUSED PINS ...................................... 13

4.

MEMORY SPACE .................................................................................................................................... 15

5.

PERIPHERAL HARDWARE FUNCTION FEATURES ............................................................................ 16

5.1

PORTS .............................................................................................................................................................. 16

5.2

CLOCK GENERATOR ...................................................................................................................................... 17

5.3

TIMER/EVENT COUNTER .............................................................................................................................. 18

5.4

CLOCK OUTPUT CONTROL CIRCUIT ......................................................................................................... 20

5.5

BUZZER OUTPUT CONTROL CIRCUIT ....................................................................................................... 20

5.6

SERIAL INTERFACES ..................................................................................................................................... 21

6.

INTERRUPT FUNCTIONS AND TEST FUNCTIONS .......................................................................... 22

6.1

INTERRUPT FUNCTIONS ............................................................................................................................... 22

6.2

TEST FUNCTIONS .......................................................................................................................................... 25

7.

EXTERNAL DEVICE EXPANSION FUNCTIONS ................................................................................. 26

8.

STANDBY FUNCTIONS ......................................................................................................................... 26

9.

RESET FUNCTION .................................................................................................................................. 26

10. INSTRUCTION SET ................................................................................................................................ 27

11. ELECTRICAL SPECIFICATIONS ............................................................................................................. 30

12. CHARACTERISTIC CURVE (REFERENCE VALUES) ........................................................................... 48

13. PACKAGE DRAWINGS ........................................................................................................................... 52

14. RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 56

APPENDIX A. DEVELOPMENT TOOLS ...................................................................................................... 57

APPENDIX B. RELATED DOCUMENTS ...................................................................................................... 59

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