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LE25S161 Datasheet(PDF) 5 Page - ON Semiconductor

Part # LE25S161
Description  Serial Flash Memory
PDF  54 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

LE25S161 Datasheet(HTML) 5 Page - ON Semiconductor

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LE25S161
www.onsemi.com
5
Package Dimensions
unit : mm
LE25S161FDTWG
VSOIC8 NB
CASE 753AA
ISSUE O
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL
CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15mm PER SIDE. DIMENSION E DOES
NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25mm PER
SIDE. DIMENSIONS D AND E ARE DETERMINED AT
DATUM F.
5. DATUMS A AND B ARE TO BE DETERMINED AT
DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
A
DIM
MIN
MAX
MILLIMETERS
A
0.65
0.85
b
0.31
0.51
e
1.27 BSC
A1
0.05
C
M
0.25
GENERIC
MARKING DIAGRAM*
*This information is generic. Please refer
to device data sheet for actual part
DIMENSION: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2
0.25 BSC
A
TOP VIEW
C
0.20
A-B D
C
0.10
NOTE 5
C
0.10
b
8X
B
C
8X
SIDE VIEW
END VIEW
DETAIL A
7.00
8X
1.52
8X
0.60
1.27
PITCH
RECOMMENDED
1
L
F
SEATING
PLANE
DETAIL A
D
L2
A1
C
NOTE 6
1
4
5
8
C
0.10
A-B
NOTE 5
e
c
0.17
0.25
L
0.40
1.27
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
= Pb-Free Package
XXXXXXXXX
ALYWX
1
8
2X
NOTE 4
2X 4 TIPS
C
0.10
2X
NOTE 4
D
4.90 BSC
E
6.00 BSC
E1
3.90 BSC
E
E1
D
D
(Note: Microdot may be in either location)



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