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SC2200 Datasheet(PDF) 429 Page - National Semiconductor (TI) |
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SC2200 Datasheet(HTML) 429 Page - National Semiconductor (TI) |
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429 / 433 page ![]() Revision 3.0 429 www.national.com Package Specifications (Continued) Figure 9-2. 481-Terminal TEPBGA Package (Body Size: 40x40x2.38 mm; Pitch: 1.27 mm) NOTES: UNLESS OTHERWISE SPECIFIED. 1) SOLDER BALL COMPOSITION: SN 63%, PB 37%. 2) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 3) THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION. 4) REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAU-1. 5) THETA JUNCTION TO CASE (TJC)= 5°C/WATT. |
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