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SC2200 Datasheet(PDF) 428 Page - National Semiconductor (TI) |
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SC2200 Datasheet(HTML) 428 Page - National Semiconductor (TI) |
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428 / 433 page ![]() www.national.com 428 Revision 3.0 9.0 Package Specifications The figures in this section provide the mechanical package outlines for the 432-Terminal EBGA (Enhanced Ball Grid Array) and 481-Terminal TEPBGA (Thermally Enhanced Ball Grid Array) packages. Figure 9-1. 432-Terminal EBGA Package (Body Size: 40x40x1.72 mm; Pitch: 1.27 mm) NOTES: UNLESS OTHERWISE SPECIFIED. 1) SOLDER BALL COMPOSITION: SN 63%, PB 37%. 2) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 3) REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.00, DATED JUNE 1997. 4) THETA JUNCTION TO CASE (TJC)= 1°C/WATT. |
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