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ZL2004 Datasheet(PDF) 33 Page - Renesas Technology Corp |
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ZL2004 Datasheet(HTML) 33 Page - Renesas Technology Corp |
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33 / 42 page ![]() ZL2004 FN6846 Rev. 3.00 Page 33 of 42 February 15, 2011 Table 22. SMBus Address Values RSA SMBus Address RSA SMBus Address 10 k W 0x00 34.8 k W 0x0D 11 k W 0x01 38.3 k W 0x0E 12.1 k W 0x02 42.2 k W 0x0F 13.3 k W 0x03 46.4 k W 0x10 14.7 k W 0x04 51.1 k W 0x11 16.2 k W 0x05 56.2 k W 0x12 17.8 k W 0x06 61.9 k W 0x13 19.6 k W 0x07 68.1 k W 0x14 21.5 k W 0x08 75 k W 0x15 23.7 k W 0x09 82.5 k W 0x16 26.1 k W 0x0A 90.9 k W 0x17 28.7 k W 0x0B 100 k W 0x18 31.6 k W 0x0C Using this method, the user can theoretically configure up to 625 unique SMBus addresses, however the SMBus is inherently limited to 128 devices so attempting to configure an address higher than 128 (0x80) will cause the device address to repeat (i.e, attempting to configure a device address of 129 (0x81) would result in a device address of 1. Therefore, the user should use index values 0-4 on the SA1 pin and the full range of index values on the SA0 pin, which will provide 125 device address combinations. Table 23. SMBus Address Index Values RSA SA0 or SA1 Index RSA SA0 or SA1 Index 10 k W 0 34.8 k W 13 11 k W 1 38.3 k W 14 12.1 k W 2 42.2 k W 15 13.3 k W 3 46.4 k W 16 14.7 k W 4 51.1 k W 17 16.2 k W 5 56.2 k W 18 17.8 k W 6 61.9 k W 19 19.6 k W 7 68.1 k W 20 21.5 k W 8 75 k W 21 23.7 k W 9 82.5 k W 22 26.1 k W 10 90.9 k W 23 28.7 k W 11 100 k W 24 31.6 k W 12 6.11 Digital-DC Bus The Digital-DC Communications (DDC) bus is used to communicate between Zilker Labs Digital-DC devices. This dedicated bus provides the communication channel between devices for features such as sequencing, fault spreading, and current sharing. The DDC pin on all Digital-DC devices in an application should be connected together. A pull-up resistor is required on the DDC bus in order to guarantee the rise time as follows: Rise time = RPU * CLOAD ≈ 1 µs, where RPU is the DDC bus pull-up resistance and CLOAD is the bus loading. The pull-up resistor may be tied to VR or to an external 3.3V or 5V supply as long as this voltage is present prior to or during device power-up. As rules of thumb, each device connected to the DDC bus presents approx 10 pF of capacitive loading, and each inch of FR4 PCB trace introduces approx 2 pF. The ideal design will use a central pull-up resistor that is well-matched to the total load capacitance. In power module applications, the user should consider whether to place the pull-up resistor on the module or on the PCB of the end application. The minimum pull-up resistance should be limited to a value that enables any device to assert the bus to a voltage that will ensure a logic 0 (typically 0.8 V at the device monitoring point) given the pull-up voltage (5 V if tied to VR) and the pull-down current capability of the ZL2004 (nominally 4 mA). 6.12 Phase Spreading When multiple point of load converters share a common DC input supply, it is desirable to adjust the clock phase offset of each device such that not all devices start to switch simultaneously. Setting each converter to start its switching cycle at a different point in time can dramatically reduce input capacitance requirements and efficiency losses. Since the peak current drawn from the input supply is effectively spread out over a period of time, the peak current drawn at any given moment is reduced and the power losses proportional to the IRMS 2 are reduced dramatically. |
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