Monolithic Devices-Product Flow Matrix

The device shall be screened as specified in the table below. NON-COMPLIANT but in accordance with Mil-Std-883.

Manufactured batches shall have Lots tests carried out in accordance with Mil-Std-883 (Mil-M-38510)

All manufacturing is carried out at DSCC approved facilities.

Screening

Method

/C

/I

/B

(5004)

/B05

(5005)

QA test condition

UpScreen

only

Visual Inspection Kit

Incoming and

Outgoing

Inspection

Procedures

100%

100%

100%

100%

100%

Temperature Cycling

100%

100%

1010, test condition C

-

Centrifuge

100%

2001E

-

Constant acceleration

100%

100%

2001, test condition E

(min)Y1 orientation

-

Seal

a. Fine

b. Gross

100%

100%

100%

1014

Cond A or B

Cond C

-

Visual inspection

100%

100%

FT WIP documentation

100%

Interim (pre-BI)Electrical

In accordance with

applicable device

specification. or as

defined in QM

p4.1.1

100%

100%

100%

Burn-in test

Dynamic

100%

100%

1015, 160 hours at 125°C

minimum

-

Percentage defective

allowable (PDA) calculation

Review

5%

QCI

-

Final GrpA Electrical Tests

A)Static Tests: 25oC

(subgrp.1) Max.& Min.

subgrp 2,3)

B) Dynamic (Linear devices)

25oC (subgrp.4) Max.& Min.

subgrp 5,6)

C)Functional 25oC

(subgrp.7) Max.& Min.

subgrp 8)

D) Switching (Digital

devices) 25oC (subgrp.9)

Max.& Min. subgrp 10,11)

In accordance with

applicable device

specification. or as

defined in QM

p4.1.1

100%

100%

-40oC

+85oC

100%

-55oC

+125oC

100%

-55oC

+125oC

5005 p2

100%

Tmin

Tmax

External Visual

100%

100%

100%

2009

100%

Group B

-

100%

2015/2003/2011

-

Group C

-

100%

1005

-

Group D

-

100%

2016/2004/1014/1011/

1010/1004/2002/2007/

2001/1009/1018/2025/2024

-

Marking & Inspect

As FT WIP

documentation

100%

100%

100%

100%

Data Preparation

As FT QA

documentation

100%

100%

100%

100%

Dry Bake store/ship

As FT WIP

documentation

100%

100%

100%

JEDEC

100%

Note.

Suffix code

/C

=

Parts are assembled and tested to Commercial temperature 0oC to +70oC

/I

=

Parts are assembled and tested to Extended temperature -40oC to +85oC

/B

=

Parts are Based on METHOD 5004 screening procedures and Mil-Std-883F Test methods.

/B5

=

Parts are Based on Control Procedures for :

GroupA (Electrical)

GroupB (Enviromental)

GroupC (Die related)

GroupD (Package related) Tests.

It is based on METHOD 5005 Conformance procedures and Mil-Std-883F Test methods

Rev 1.1

29/30

2011