GS3241 datasheet(4/108 Pages) SEMTECH

4 / 108 page

GS3241

Final Data Sheet

Rev.2

PDS-061444

September 2017

4 of 108

Semtech

Proprietary & Confidential

www.semtech.com

4.7.5 Trace Driver DC coupling requirements ..................................................................... 48

4.7.6 Output State Control Modes ........................................................................................... 49

4.7.7 Output Waveform Specifications .................................................................................. 50

4.8 GPIO Controls .................................................................................................................................... 51

4.9 GSPI Host Interface ......................................................................................................................... 51

4.9.1 CS Pin ....................................................................................................................................... 51

4.9.2 SDIN Pin .................................................................................................................................. 52

4.9.3 SDOUT Pin.............................................................................................................................. 52

4.9.4 SCLK Pin .................................................................................................................................. 53

4.9.5 Command Word 1 Description....................................................................................... 54

4.9.6 GSPI Transaction Timing...................................................................................................56

4.9.7 Single Read/Write Access ................................................................................................. 57

4.9.8 Auto-increment Read/Write Access ............................................................................. 59

4.9.9 Setting a Device Unit Address ........................................................................................ 60

4.9.10 Default GSPI Operation...................................................................................................61

4.9.11 Clear Sticky Counts Through Four Way Handshake............................................. 62

4.9.12 Device Power-up Sequence.......................................................................................... 62

4.9.13 Host Initiated Device Reset ........................................................................................... 63

5. Register Map................................................................................................................................................... 65

5.1 Control Registers ............................................................................................................................. 65

5.2 Status Registers ................................................................................................................................ 68

5.3 Register Descriptions ..................................................................................................................... 69

6. Application Information........................................................................................................................... 104

6.1 Typical Application Circuit ......................................................................................................... 104

7. Package & Ordering Information .......................................................................................................... 105

7.1 Package Dimensions .................................................................................................................... 105

7.2 Recommended PCB Footprint .................................................................................................. 106

7.3 Packaging Data .............................................................................................................................. 106

7.4 Marking Diagram ........................................................................................................................... 107

7.5 Solder Reflow Profiles ..................................................................................................................107

7.6 Ordering Information ...................................................................................................................107

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